News Update

Solder joint reliability in a lead-free climate When the issue of the mandatory move to lead-free was first discussed in the electronics industry, it was the general consensus that the move would enable more reliable solder joints. Indeed, this was backed up by testing of tin-silver-copper systems, which highlighted that the trend should deliver stronger joints. However, as the research effort increases, it has become clear that at least with certain package types, lead-free assemblies could be more vulnerable to failures.  more...

Restoring certainty to variable manufacturing environments As a global manufacturer, you cannot help but be aware of the fact that you will be required to Go Lead-Free in a matter of months. At Henkel, we know that the vast majority of our electronics customers have already ensured that their processes comply with the RoHS directive. However, for those who have resisted the transition up until now, there is still time to Go Lead-Free confidently. more...

Taking the stress out of CSP and BGA packages A decade ago, device and component miniaturization of the scale we are familiar with today was unheard of, let alone anticipated. Indeed, currently, the drive towards miniaturization appears to be unstoppable, with Chip Scale Packages and Ball Grid Arrays powering this advance. However, as we move into the lead-free era, underfills are playing an increasingly important role in enhancing the reliability of lead-free CSP devices. more...