Solder joint reliability in a lead-free climate
When the issue of the mandatory move to lead-free was first discussed in the electronics industry, it was the general consensus that the move would enable more reliable solder joints. Indeed, this was backed up by testing of tin-silver-copper systems, which highlighted that the trend should deliver stronger joints. However, as the research effort increases, it has become clear that at least with certain package types, lead-free assemblies could be more vulnerable to failures.
